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Chip Stress Plots
Photograph of WR1.5 DMProbe chip (left) with
dc bias capability drop mounted in a
split-block housing module.
Contour plot of the stress of the probe chips under
a 1 mN load at each tip. Scale is in Pascals.
View of two microfabricated probes with 10um long tips contacting a calibration standard. Photo courtesy of Northrop Grumman Aerospace Corporation.


Our wafer probes set the industry standard for performance. DMPI designs, manufactures and sells millimeter and sub-millimeter wavelength on-wafer ground-signal-ground probes and associated components for electrical measurement of devices and materials. We have developed a scalable approach for the manufacturing of phsyically robust micro machined probes with low-insertion loss coupling to the DUT and DC biasing of probed circuits. The Si probe chip is mounted in a machined waveguide split block allowing for drop-in replacement of the probe chip without needing replacement of the entire block module. If the outer metal block package isundamaged (block damage is a rare event), the probe can typically be repaired within one week, and can be repaired numerous times (we have been using some test blocks for several years with over a hundred probe replacements, i.e., repairs). Repaired probes have typical performance "as new".

From our Machined Probe (MPR) line: WR1.5, WR2.2, WR3.4, WR4.3 and WR5.1 DMProbes are available to order.


NEW PRODUCTS:

* DMPI  WR3.4, WR4.3, & WR5.1 MProbes, with probe pitches of 25, 50, 75 and 100um   

3p4 GPPO

WR3p4 DMProbe, with GPPO to SMA dc bias connector/cable,
direct waveguide connected to a VDI VNA Extender

* DMPI  WR1.5, WR2.2, & WR3.4 Machined 90 degree Twists (MTW) that are much more physically robust and precisely manufactured than commercially offered drawn twists. DMProbes at WR1.5 and WR2.2 require a direct waveguide connection method to the VNA extender (our WR3.4 probes can also be direct waveguide connected) - see our Products page for more details.
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* DMPI 1.5M90WB, 2.2M90WB, DMPI 3.4M90WB Machined 90 degree Waveguide Bends (also for a direct waveguide connection method) that are much more physically robust and precisely manufactured than commercially offered drawn bends. For probe stations, two DMPI 90 Bends can be joined to form an "S bend" to realize an appropriate vertical position of the DMProbe to the DUT/Wafer platen (see our Products page) . Commercial bends are also typically manufactured with little control over the relativel orientation of the two waveguide faces, so the use of commercial bends may result in a probe that is presented at a cocked orientation to the DUT. In contrast, our machined splitblock DMBends are physically robust and machined to exacting tolerances, making them the perfect candidate for wafer probing.

* DMPI drawn waveguide components at WR3.4, WR4.3 & WR5.1 for attaching your DMPI probe to the VNA extender on commercial probe stations. DMProbes at WR4.3 and WR5.1 require an rf positioner connection method to the VNA extender (our WR3.4 probes can also be rf positioner connected) - see our Products page for more details. Inquire with DMPI about the needed components for your particular probe station.

sales@dmprobes.com

Product Returns for Repairs: Information & Pricing

Measured Sparam WR2.2 WR1p5 Sparameters

simulated WR5p1 data

Simulated WR4p3 data

 


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